Memory pack

ABSTRACT

The present invention provides a thin connector in which contacts to be brought into contact with terminals of a memory card are less liable to be deformed when the connector is assembled or an external force is exerted on the connector. The contacts ( 4 ) are located at a lower level than upper surfaces of protective projections ( 3   a ), and distal ends of the contacts ( 4 ) are located at a higher level than lower surfaces of the protective projections ( 3   a ). This prevents the deformation of the contacts, and allows the connector to have a smaller thickness. Further, the contacts are located at a lower level than the upper surfaces of the protective projections when the protective projections are deformed to be brought into contact with bottom portions of recesses of the memory card. Thus, the contacts are less liable to be deformed by an external force.

The present application is based on International ApplicationPCT/JP2004/013273, filed Sep. 6, 2004, which application is incorporatedherein by reference in its entirety.

TECHNICAL FIELD

The present invention relates to a memory pack for use in a portableinformation processing device or the like.

BACKGROUND ART

In recent years, the capacities of the flash memories have beenincreased, and adaptors removably attached to various types of memorycards, memory packs incorporating one or more memory cards and otherinformation processing devices mounted with memories have beendeveloped.

There have been known various structures of the memory packs forincorporating a memory card such as a PC card. Further, inventions havebeen made to meet a demand for reduction of the thickness of the PCcard.

In general, terminals of the memory card are connected to an electriccircuit provided in the memory pack via a connector. For example, an ICcard connector having the smallest possible thickness yet having asufficient mechanical strength is known (see, for example, JP2002-329553A). The IC card connector is adapted to receive an SD card asthe IC card inserted therein with terminals of the SD card facing up,and includes a plurality of connection terminals embedded in a basethereof to be brought into contact with electrode pads of the terminalsof the SD card.

Further, a PC card including a plurality of memory cards is known (see,for example, JP 9-102019A).

FIGS. 10 to 13 illustrate an example of a prior art memory pack of a PCcard size. FIG. 10 is a perspective view of the memory pack with itsupper cover removed, and FIG. 11 is a perspective view of a printedboard and a connector. FIG. 12 is an explanatory diagram for assembling,and FIG. 13 is a sectional view taken along a line X-X in FIG. 10.

In FIGS. 10 to 13, a reference numeral 100 denotes a frame having abottom and a housing space. A reference numeral 101 denotes an uppercover of a thin rectangular metal plate which is combined with the frame100 to define a housing. In general, the upper cover 101 is fixed to theframe 100 by a snap-in or fusion bonding method or with the use ofscrews. A reference numeral 102 denotes a printed board, which is fixedin the housing space of the frame 100 with the use of an adhesive orscrews. An electronic component 108 such as a control LSI is mounted ona rear surface of the printed board 102. A reference numeral 103 denotesa pair of connector bases, which are composed of an insulator such as aresin and disposed in a middle portion of the printed board 102 asextending widthwise of the printed board in parallel relation. The bases103 each have a plurality of recesses extending widthwise thereof andarranged at predetermined intervals in parallel relation. A referencenumeral 104 denotes contacts, which are composed of gold-plated phosphorbronze or beryllium copper and fitted in the recesses of the bases 103at a predetermined pitch in parallel relation. One-end portions of thecontacts 104 project from the corresponding bases 103 to overhang theprinted board 102. The other ends of the contacts 104 are electricallyconnected to a circuit pattern (not shown) formed on the printed board102 to form a predetermined electric circuit. The connector isconstituted by the bases 103 and the contacts 104.

A reference numeral 105 denotes memory cards. In this example, four SDmemory cards are used, and accommodated in the housing of the PC card. Areference character 105 a denotes a plurality of recesses formed in anedge portion of each of the memory cards 105 and arranged at the samepitch as the contacts 104. Terminals 105 b are respectively provided onbottom surfaces of the recesses 105 a, and brought into contact with thecontacts 104 for electrical connection. A reference numeral 106 denotesa card connector, which is mounted on the printed board 102 and permitssignal transmission with respect to an external device. A referencenumeral 107 denotes a ground plate, which covers the card connector 106for reduction of influences of noise.

When the memory pack is assembled, the connector with the plurality ofcontacts 104 preliminarily attached to the bases 103 thereof is fixed tothe printed board 102 as shown in FIG. 11. Then, as shown in FIG. 12,two front memory cards 105 are inserted in an arrow direction A and theother two memory cards 105 are inserted in an arrow direction B towardthe bases 103 of the connector. With terminal-side edges of the memorycards 105 abutting against walls of the, bases 103, the contacts 104 arein contact with the terminals 105 b of the memory cards. As shown inFIG. 10, the resulting unit is fixed in the frame 100, and the uppercover 101 is attached to the frame 100.

In the prior art, however, the contacts 104 project from the bases 103in an uncovered state as shown in FIG. 11. Therefore, when the connectoris transported or attached to the board 102 or the memory cards 105 areinserted into the connector, the contacts 104 of the connector areliable to be deformed in contact with various things. This may result ininsufficient contact between the contacts 104 and the terminals 105 b ofthe memory cards 105.

DISCLOSURE OF THE INVENTION

In view of the foregoing, it is an object of the present invention toprovide a thin memory pack which includes a connector mounted thereinand is capable of preventing deformation of contacts of the connectorwhen the connector is transported or assembled or memory cards areinserted into the connector.

According to the present invention to solve the aforesaid problem, thereis provided a memory pack, which comprises: a frame defining a housing;a printed board fixed in the frame; a connector including a base fixedto the printed board and a plurality of contacts projecting, from thebase, generally parallel to the printed board and arranged at apredetermined pitch in parallel relation; protective projectionsprovided, on the base, generally parallel to the contacts in thevicinity of the contacts in such a manner as to permit vertical movementof the contacts; and at least one memory card disposed on the printedboard with terminals thereof facing up in contact with the contacts,wherein the contacts are located at a lower level than upper surfaces ofthe protective projections and distal ends of the contacts are locatedat a higher level than lower surfaces of the protective projections.

In the inventive memory pack, the protective projections are provided inthe vicinity of the contacts which are in contact with the terminals ofthe memory card disposed in the memory pack. Therefore, when the memorypack is transported or assembled or the memory card is inserted into theconnector, the contacts are less liable to be brought into contact withother components thereby to be prevented from being deformed.

The contacts are located at a lower level than the upper surfaces of theprotective projections when the protective projections are deformedtoward the printed board into abutment against bottom portions ofrecesses of the memory card.

As described above, the contacts do not project upward from the uppersurfaces of the protective projections, even if an external force isapplied to the protective projections to press and deform the protectiveprojections. Therefore, no force is exerted on the contacts, so thatdeformation of the contacts can be effectively prevented.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a perspective view of an inventive memory pack with its uppercover removed;

FIG. 2 is a perspective view of a printed board and a connectoraccording to the invention;

FIG. 3 is an explanatory diagram for assembling the inventive memorypack;

FIG. 4 is a partial enlarged view of contacts according to theinvention;

FIG. 5 is a sectional view of the contact with a memory card notinserted according to the invention;

FIG. 6 is a sectional view of the contact with the memory card insertedaccording to the invention;

FIG. 7 is a diagram for explaining a state in which an external forceacts on the contacts according to the invention;

FIG. 8 is a partial enlarged view of contacts according to anotherembodiment of the invention;

FIG. 9 is a partial enlarged view of contacts according to furtheranother embodiment;

FIG. 10 is a perspective view of a prior art memory pack with its uppercover removed;

FIG. 11 is a perspective view of a printed board and a connectoraccording to the prior art;

FIG. 12 is an explanatory diagram for assembling the prior art memorypack; and

FIG. 13 is a sectional view of the prior art memory pack.

BEST MODE FOR IMPLEMENTING THE INVENTION

According to a first aspect of the present invention, there is provideda memory pack, which comprises: a frame defining a housing; a printedboard fixed in the frame; a connector including a base fixed to theprinted board and a plurality of contacts projecting from the basegenerally parallel to the printed board and arranged at a predeterminedpitch in parallel relation; protective projections provided on the basegenerally parallel to the contacts in the vicinity of the contacts insuch a manner as to permit vertical movement of the contacts; and atleast one memory card disposed on the printed board with terminalsthereof facing up in contact with the contacts, wherein the contacts arelocated at a lower level than upper surfaces of the protectiveprojections and distal ends of the contacts are located at a higherlevel than lower surfaces of the protective projections. The protectiveprojections are provided in the vicinity of the contacts. Therefore,when the memory pack is transported or assembled or the memory card isinserted into the connector, the contacts are less liable to be broughtinto contact with other components thereby to be prevented from beingdeformed. Since the protective projections are integral with the base,the contacts can be accurately located in proper vertical positionalrelation with respect to the protective projections.

According to a second aspect of the present invention, there is provideda memory pack, which comprises: a frame defining a housing; a printedboard fixed in the frame; a connector including a base fixed to agenerally middle portion of the printed board and contacts projectingfrom the base generally parallel to the printed board longitudinally ofthe printed board and arranged at a predetermined pitch in parallelrelation; protective projections provided integrally with the basegenerally parallel to the contacts in the vicinity of the contacts insuch a manner as to permit vertical movement of the contacts; and atmost two pairs of memory cards disposed on opposite sides of theconnector on the printed board with terminals thereof facing up incontact with the contacts, wherein the contacts are located at a lowerlevel than upper surfaces of the protective projections and distal endsof the contacts are located at a higher level than lower surfaces of theprotective projections. In the memory pack in which at most four memorycards are mountable, the protective projections are disposed in thevicinity of the contacts. Therefore, when the memory pack is transportedor assembled or the memory cards are inserted into the connector, thecontacts are less liable to be brought into contact with othercomponents thereby to be prevented from being deformed. Since theprotective projections are provided integrally with the base, thecontacts can be accurately located in proper vertical positionalrelation with respect to the protective projections.

According to a third aspect of the present invention, the terminals ofthe memory card are provided in bottom portions of recesses formed inthe memory card at a lower level than the upper surface of the memorycard, and the protective projections each have a smaller width than therecesses, and are configured such that a height of the lower surfaces ofthe protective projections as measured from the printed board is greaterthan a height of the terminals as measured from a lower surface of thememory card. With this arrangement, the protective projections areengageable with the recesses of the memory card. This makes it possibleto reduce the height of the protective projections.

According to a fourth aspect of the present invention, the contacts arelocated at a lower level than the upper surfaces of the protectiveprojections when the protective projections are deformed toward theprinted board into abutment against the bottom portions of the recessesof the memory card. With this arrangement, the contacts are located at alower level than the upper surfaces of the protective projections evenif an external force is applied to the protective projections to deformthe protective projections. Therefore, no force is exerted on thecontacts, so that the deformation of the contacts can be prevented.Thus, the contacts are stably kept in contact with the terminals.

According to a fifth aspect of the present invention, the protectiveprojections respectively have holes, and the contacts provided on thebase are disposed in the respective holes in a vertically movablemanner. According to a sixth aspect of the present invention, theprotective projections each have a U-shape to surround the respectivecontacts. With this arrangement, the contacts respectively provided inthe holes of the protective projections are perfectly protected by theprotective projections.

EMBODIMENTS

An embodiment of the present invention will hereinafter be describedwith reference to FIGS. 1 to 7. Components denoted by the same referencecharacters as in the prior art have the same structures as in the priorart, and will not be explained in detail.

First, the construction of a connector of a memory pack according tothis embodiment will be described. The memory pack according to thisembodiment is a PC card in which four SD memory cards are mounted. FIG.1 is a perspective view illustrating the inventive memory pack with itsupper cover removed. FIG. 2 is a perspective view illustrating theconnector fixed on a printed board.

In FIGS. 1 and 2, a frame 1 is formed of a resin, or produced by metalplate working or die casting. The frame 1 is combined with an uppercover not shown to define a housing of the PC card. A main body 1A ofthe frame 1 includes frame portions 1 a provided on opposite sidesthereof as a framework and a bottom portion provided between the frameportions 1 a to define a housing space in which the printed board 2 ishoused. The upper cover 10 has the same construction as in the priorart, and fixed to the frame 1 in the same manner as in the prior art.

An electronic component such as a control LSI is mounted on a rearsurface of the printed board 2 as in the prior art. The connectorincludes two bases 3 spaced a predetermined distance from each other inparallel relation and fixed to a generally middle portion of an uppersurface of the printed board 2. The bases are composed of a resinmaterial such as a liquid crystal polymer, PPS or PBT which is heatresistant, highly rigid and insulative.

Contacts 4 are rectangular thin plates composed of gold-plated phosphorbronze or beryllium copper as in the prior art and having apredetermined configuration. The contacts 4 are attached to the bases ofthe connector and arranged at a predetermined pitch in parallel relationas projecting longitudinally of the printed board 2 from the bases 3generally parallel to the printed board 2. The bases 3 have fixing holes3 f for fixing the contacts 4 to the bases. The contacts 4 arepress-fitted in the fixing holes 3 f, or inserted in the fixing holes 3f and fixed by clogging the fixing holes 3 f with spacers. The methodfor fixing the contacts 4 to the bases 3 is not limited to the aforesaidmethod. The contacts 4 may be insert-molded in the bases 3. One-endportions of the contacts 4 fixed to the bases 3 project from the bases 3to overhang the printed board 2 (see FIG. 5). The one-end portions ofthe contacts 4 are curved downward so as to be easily brought intocontact with terminals 105 b. The other end portions of the contacts 4are bent perpendicularly for electrical connection to a circuit pattern2 a formed on the printed board 2 to form en electric circuit.

Protective projections 3 a are of an elongated U-shape, and each have ahole 3 b. The protective projections 3 a each have a thickness and awidth sufficient to withstand a certain pressure. The protectiveprojections 3 a are provided integrally on the bases 3, and project fromthe bases 3 parallel to the printed board 2 longitudinally of theprinted board 2. The protective projections 3 a are arranged generallyparallel to the contacts 4, and respectively surround the contacts 4.The contacts 4 are located at a lower level than upper surfaces 3 d ofthe protective projections 3 a. The downwardly curved one-end portionsof the contacts 4 project from lower surfaces 3 e of the protectiveprojections.

The holes 3 b of the protective projections 3 a each have a greaterwidth than the contacts 4, and a greater length than the one-endportions of the contacts 4. Therefore, the contacts 4 are verticallymovable within the holes 3 b. The protective projections 3 a are formedintegrally with the bases 3, and the contacts 4 are firmly fixed to thebases 3 in engagement with the fixing holes 3 f preliminarily formed inthe bases 3. Therefore, the contacts 4 are accurately located in propervertical positional relation with respect to the protective projections3 a.

Since the connector has the protective projections 3 a as describedabove, the contacts 4 are prevented from being brought into directcontact with foreign matter. Therefore, when the connector istransported or attached to the board, the contacts 4 are less liable tobe deformed.

How to assemble the memory pack will hereinafter be explained. For theassembling of the memory pack, the contacts 4 are inserted into thefixing holes 3 f formed in the bases 3 thereby to be fixed to the bases3. Thus, the connector is prepared. Then, the bases 3 are fixed to theupper surface of the printed board 2 preliminarily mounted with theelectronic component, and the other end portions of the contacts 4 areconnected to the pattern 2 a formed on the printed board 2 as shown inFIG. 4 by a surface mounting method or the like.

In turn, the memory cards 105 are inserted toward the bases 3 of theconnector along the printed board 2 with the terminals thereof facingup. In this embodiment, the memory cards 105 are SD memory cards. FIG. 3is an explanatory diagram for the assembling. The two front memory cardsare inserted in an arrow direction A, and the other two memory cards areinserted in an arrow direction B. With distal edges of the insertedmemory cards 105 abutting against the bases 3, the terminals 105 b ofthe memory cards are in contact with the contacts 4. Even if the memorycard 105 to be inserted into the connector is slightly offset upwardfrom the printed board 2, the lower surfaces 3 e of the protectiveprojections 3 a serve as a guide and, therefore, the memory card 105 canbe inserted into the connector in sliding contact with the lowersurfaces 3 e of the protective projections 3 a.

Next, a relationship between the connector and the memory card in thememory pack according to this embodiment will be explained. FIG. 4 is apartial enlarged view of the contacts with the memory card inserted.FIG. 5 is a sectional view of the memory pack with the memory card notinserted, and FIG. 6 is a sectional view of the memory pack with thememory card inserted. In FIGS. 4 to 6, the terminals 105 b of the SDmemory card are provided on bottom surfaces of recesses 105 a which arelocated at a lower level than an upper surface of the SD memory card.Here, the following expressions (1) and (2) are satisfied:d2<d1   (1)h2>h1   (2)wherein d1 is the width of the recesses 105 a of the memory card 105, h1is the height of the terminals 105 b of the memory card 105 as measuredfrom a lower surface of the memory card 105, d2 is the width of theprotective projections 3 a, and h2 is the height of the lower surfaces 3e of the protective projections as measured from the printed board 2.

By adjusting the width of the protective projections 3 a and the heightof the lower surfaces of the protective projections 3 a to satisfy theexpressions (1) and (2), the protective projections 3 a are madeengageable with the terminals 105 b of the memory card 105.

In FIG. 5, the level of distal ends 4 a of the contacts 4 is higher thanthe level (h2) of the lower surfaces 3 e of the protective projections 3a as measured from the printed board 2, and lower than the upper surface3 d of the protective projections 3 a. With this arrangement, the memorycard 105 can be inserted into the connector along the lower surfaces 3 eof the protective projections 3 a even if the memory card 105 is offsetslightly upward when inserted. Since the distal ends 4 a of the contactsare located at a higher level than the lower surfaces of the protectiveprojections 3 a, the distal ends 4 a of the contacts are prevented frombeing caught by the distal edge of the memory card 105. Thus, thedeformation of the contacts 4 is prevented. If the memory card 105 issignificantly vertically offset when inserted, the distal edge of thememory card 105 abuts against distal ends of the protective projections3 a to prevent the insertion of the memory card 105. In this case, noforce acts on the contacts 4, because the contacts 4 are located insidethe protective projections 3 a. Thus, the deformation of the contacts isprevented. The distal edges of the lower surfaces of the protectiveprojections 3 a may be chambered to be rounded to ensure easierinsertion of the memory card 105.

The aforesaid arrangement prevents the deformation of the contacts 4when the memory card 105 is inserted into the connector. By fitting theprotective projections 3 a surrounding the contacts 4 in the recesses105 a, the protective projections 3 a are partly or entirely located ata lower level than the upper surface of the memory card 105. As aresult, the connector is allowed to have a reduced thickness.

Next, a case where an external force is applied from the upper side ofthe memory pack will be described with reference to FIG. 7. In FIG. 7, areference numeral 10 denotes the upper cover, which is typically formedof a metal plate or a resin. In this embodiment, the housing of thememory pack conforms to the PC Card Standard. In general, the thicknessof the PC card is specified by the standard. A type-II PC card, forexample, is required to have a thickness of 5 mm at the maximum. Wherethe printed board 2 mounted with the electronic component, the memorycards 105 and the like are incorporated in the PC card as in thisembodiment, the upper cover 10 is generally required to have a smallerthickness. Therefore, it is difficult for the upper cover to have asufficient strength and rigidity. When an external force acts in anarrow direction C as shown in FIG. 7, the upper cover 10 is liable to bedeformed downward (i.e., toward the printed board 2). If the contacts 4were exposed without the provision of the protective projections 3 a,the contacts would be pressed down to be deformed by the upper cover 10significantly deformed downward. As a result, the contacts 4 wouldinsufficiently contact the terminals 105 b of the memory card, failingto ensure the normal operation of the memory card.

On the contrary, the protective projections 3 a are provided integrallywith the base 3 as shown in FIG. 7 in this embodiment. When the uppercover 10 is deformed downward, the lower surface of the upper cover 10presses the upper surfaces 3 d of the protective projections 3 a. Thisis because the upper surfaces 3 d are located at a higher level than thecontacts 4. The protective projections 3 a, which are composed of theresin, are resiliently deformable within a certain range. That is, thedistal end portions of the protective projections 3 a are deformedcounterclockwise (as seen in FIG. 7) about proximal ends of theprotective projections 3 a, so that distal end lower portions 3 c of theprotective projections 3 a are brought into abutment against the bottomsurfaces of the recesses 105 a of the memory card 105. Gaps between thelower surfaces 3 e of the protective projections 3 a and the bottomsurfaces of the recesses 105 a of the memory card 105 are defined so asnot to permit permanent deformation of the resin protective projections.The memory card 105 is located on the printed board 2 and, though notshown, the lower portion of the printed board 2 is supported on theframe 1. Therefore, the deformation of the protective projections 3 a isprevented with the distal end lower portions 3 c of the protectiveprojections 3 a in abutment against the bottom surfaces of the recesses105 a of the memory card 105, which in turn support the external force.In this state, the upper cover 10 does not press the contacts 4, becausethe positional relation between the contacts 4 and the protectiveprojections 3 a is defined so that the contacts 4 are located at a lowerlevel than the upper surfaces 3 d of the deformed protective projections3 a. As a result, no force acts on the contacts 4, so that the contacts4 are stably kept in contact with the terminals 105 b of the memory card105.

Though not shown, spherical protuberances may be provided on the distalend lower portions 3 c of the protective projections 3 a so as toconstantly abut against the bottom surfaces of the recesses 105 a inthis embodiment. Thus, the proper dimensional relation can be stablyprovided when the protective projections 3 a abut against the bottomsurfaces of the recesses 105 a.

This embodiment has been described with the memory card in which theterminals 105 b are provided on the bottom surfaces of the recesses 105a, but the present invention may be embodied with a memory card in whichthe terminals 105 b are provided on the upper surface of the memory card105. In this case, protective projections may be provided for therespective contacts, or adjacent protective projections may be combinedwith each other. All the protective projections for the respectivecontacts may be combined together, or some of the protective projectionsmay be combined to form two or more groups of protective projections.Where all the protective projections are combined together to form onegroup of protective projections, for example, protective projectionslocated apart from one position on which an external load isconcentrated are liable to be pulled toward the one position andtwisted. In this connection, it is preferred that the protectiveprojections are provided separately from each other. This makes itpossible to provide a highly reliable connector insusceptible to atwisting force.

In this embodiment, the protective projections provided for therespective contacts are engaged with the recesses for the respectiveterminals, so that the height of the protective projections is reduced.Where there is a sufficient space above the connector, the protectiveprojections may be located at a higher level than the upper surface ofthe memory card and combined at a higher level than the upper surface ofthe memory card. In this case, all the protective projections for therespective contacts may be combined together, or some of the protectiveprojections maybe combined. However, the height of the protectiveprojections is increased as compared with this embodiment.

In this embodiment, the protective projections 3 a each have anelongated U-shape, but the shape of the protective projections 3 a isnot limited to the U-shape. The protective projections 3 a may be formedin a comb shape. For example, as shown in FIG. 8, the protectiveprojections may each include plate portions each having a predeterminedthickness and projecting from the base 3 along opposite edges of thecontact 4. The contacts 4 are preferably located at a lower level thanthe upper surfaces of the protective projections 3 a, and the distalends 4 a of the contacts 4 are preferably located at a higher level thanthe lower surfaces of the protective projections. The contacts 4 and theprotective projections 3 a are located in the same positional relationas described above.

As shown in FIG. 9, the protective projections 3 a may each have anL-shape and project from the base 3 along the contacts 4.

In the embodiment described above, the protective projections 3 a mayeach have an open upper surface or a closed upper surface.

In this embodiment, the SD memory cards are used as the memory cards,but the memory cards are not limited to the SD memory cards. The numberof the memory cards is four, but not limited to four. Further, thememory pack is not limited to the PC card.

INDUSTRIAL APPLICABILITY

The inventive memory pack can be assembled with a higher level ofreliability, and is useful for a thin portable information device whichis required to stably operate even if an external force is appliedthereto during use.

1. A memory pack for holding a memory card comprising: a frame defininga housing; a printed board fixed in the frame; a connector comprising abase fixed to the printed board; a plurality of contacts projecting fromthe base, substantially parallel to the printed board and arrangedparallel to one another; and protective projections extending from thebase, substantially parallel to the contacts to permit movement of thecontacts in a direction normal to the base, the contacts located belowupper surfaces of the protective projections, with ends of the contactsextending from the base to above lower surfaces of the protectiveprojections, wherein the protective projections respectively haveopenings, and the contacts are located in the respective openings suchthat the contacts can move in a normal direction, and the protectiveprojections each have a U-shape with the tops of the “U” affixed to thebase to surround the respective contacts.
 2. The memory pack as setforth in claim 1, wherein terminals of a memory card are in bottomportions of recesses in the memory card below the upper surface of thememory card, and the protective projections each have a smaller widththan the recesses and are fitted in the recesses of the memory card,wherein the protective projections are configured such that a height ofthe lower surfaces of the protective projections as measured from theprinted board is greater than a height of the terminals as measured froma lower surface of the memory card.
 3. The memory pack as set forth inclaim 2, wherein the contacts are below the upper surfaces of theprotective projections when the protective projections are deformedtoward the printed board against the bottom portions of the recesses ofthe memory card.
 4. The memory pack of claim 1, further comprising atleast one memory card on the printed board with terminals in contactwith the contacts.
 5. The memory pack of claim 4, wherein, before andafter inserting the memory card, the contacts are located below uppersurfaces of the protective projections, with ends of the contactsextending from the base to above lower surfaces of the protectiveprojections.
 6. A memory pack comprising: a frame defining a housing; aprinted board fixed in the frame; a connector comprising a base fixed toa generally middle portion of the printed board; contacts projectingfrom the base, substantially perpendicular to the base and substantiallyparallel to the printed board and arranged parallel to one another;protective projections extending from the base, generally parallel tothe contacts to permit movement of the contacts in a direction normal tothe base, the contacts located below upper surfaces of the protectiveprojections, with ends of the contacts extending from the base to abovelower surfaces of the protective projections; and at most two pairs ofmemory cards on opposite sides of the connector with one side of eachmemory card adjacent to the printed board and an opposite side withterminals facing up in contact with the contacts, wherein the terminalsof the memory card are in bottom portions of recesses in the memory cardbelow the upper surface of the memory card, and the protectiveprojections each have a smaller width than the recesses and are fittedin the recesses of the memory card, wherein the protective projectionsare configured such that a height of the lower surfaces of theprotective projections as measured from the printed board is greaterthan a height of the terminals.
 7. The memory pack as set forth in claim6, wherein the protective projections respectively have openings, andthe contacts are located in the respective openings such that thecontacts are movable in said normal direction.
 8. A memory pack forholding a memory card comprising: a frame defining a housing; a printedboard fixed in the frame; a connector comprising a base fixed to theprinted board; a plurality of contacts projecting from the base,substantially perpendicular to the base and substantially parallel tothe printed board and arranged parallel to one another; and protectiveprojections extending from the base, substantially parallel to thecontacts, to permit movement of the contacts in a direction normal tothe base, each contact being protected by one projection, the contactslocated below upper surfaces of the protective projections, with ends ofthe contacts extending from the base to above lower surfaces of theprotective projections, wherein the protective projections respectivelyhave openings, and the contacts are located in the respective openingssuch that the contacts are movable in said normal direction, and theprotective projections each have a U-shape with the tops of the “U”affixed to the base to surround the respective contacts.